Welcome to visit《 Journal of Air Force Engineering University 》Official website!

Consultation hotline:029-84786242 RSS EMAIL-ALERT
Simulation of the Process of Pulsed Laser Deposition of Thin Copper Film
DOI:
CSTR:
Author:
Affiliation:

Clc Number:

O484.1

Fund Project:

  • Article
  • |
  • Figures
  • |
  • Metrics
  • |
  • Reference
  • |
  • Related
  • |
  • Cited by
  • |
  • Materials
  • |
  • Comments
    Abstract:

    By mathematics and theoretic mode, the process of pulsed laser deposition of thin copper film is studied. The evolvement of plasma generated by the pulsed laser is simulated and based on this the distributions of consistence and velocity are discussed. Moreover, the physics mechanism in the process of pulsed laser deposition is explained. The results obtained are compared with the experiments and other articles.

    Reference
    Related
    Cited by
Get Citation
Share
Article Metrics
  • Abstract:
  • PDF:
  • HTML:
  • Cited by:
History
  • Received:
  • Revised:
  • Adopted:
  • Online: November 24,2015
  • Published:
Article QR Code